High strength, gap filling multi-purpose building adhesive based on a tackified solvent-free system for use in a wide variety of building and home improvement applications. Can be used where at least one of the substrates to be bonded is porous.
|High Solids Formulation - Excellent Gap Filling Properties Without Shrinkage|
MFR Part No.
|Mixtures of Biphenyl-2-ol and 2-Methyl-2h-Isothiazol-3-One|
Temperature Resistance Range
|-10 to 70°C|